Tau Wae : | EPC2012CENGR |
---|---|
Kaihanga / Waitohu : | EPC |
Whakaahuatanga : | TRANS GAN 200V 5A BUMPED DIE |
RoHs Tūnga : | Whakahaerehia te kore utu / RoHS |
He Rahinga Kei te wātea | 30059 pcs |
Ngā Rauemi | EPC2012CENGR.pdf |
Putanga - Whakamātau | 100pF @ 100V |
Tuhinga o mua - Breakdown | Die Outline (4-Solder Bar) |
Vgs (th) (Max) @ Id | 100 mOhm @ 3A, 5V |
Hangarau | GaNFET (Gallium Nitride) |
Raupapa | eGaN® |
RoHS Tūnga | Tape & Reel (TR) |
Runa I (Max) @ Id, Vgs | 5A (Ta) |
Ko te poari | Die |
Ētahi Ingoa | 917-EPC2012CENGRTR |
Tae Mahi | -40°C ~ 150°C (TJ) |
Momo Tae | Surface Mount |
Taumata Whakaaro Moe (MSL) | 1 (Unlimited) |
Waehanga Kaihanga | EPC2012CENGR |
Whakauru Whakauru (Ciss) (Max) @ Vds | 1nC @ 5V |
Puta Whakatau (Qg) (Max) @ Vgs | 2.5V @ 1mA |
FET Pānga | N-Channel |
Whakaahua nui | N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar) |
Tuku ki te Pūtake Pūtake (Vdss) | - |
Whakaahuatanga | TRANS GAN 200V 5A BUMPED DIE |
I teie nei - Ngaa Toa (Id) @ 25 ° C | 200V |
Ratonga Capacitance | - |